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搜索结果列表 共搜到关于 PI 的物性记录约 20＋条,本页只展示最多20条记录
PI，TP|Generic PI, TP|Generic
备注说明：
This data represents typical values that have been calculated from all products classified as: Generic PI, TPThis information is provided for comparative purposes only.
PI，TS|Generic PI, TS|Generic
备注说明：
This data represents typical values that have been calculated from all products classified as: Generic PI, TSThis information is provided for comparative purposes only.
Film, PI|Generic Film, PI|Generic
备注说明：
This data represents typical values that have been calculated from all products classified as: Generic Film, PIThis information is provided for comparative purposes only.
PI，TP|Generic PI, TP - Carbon Fiber|Generic
备注说明：
This data represents typical values that have been calculated from all products classified as: Generic PI, TP - Carbon FiberThis information is provided for comparative purposes only.
PI，TP|PI D7000|Quadrant Engineering Plastic Products
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Duratron® PI D7000是一种热塑性聚酰亚胺产品。它在北美洲或拉丁美洲有供货。主要特性为:阻燃/额定火焰。
PI-TP|Generic PI, TP - Carbon Fiber|Generic
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填料：碳纤维增强材料。
PI，TP|35NQ|Arlon-MED
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35NQ is a pure polyimide laminate and prepreg system. Reinforced with woven Quartz fabric, combining the advantages of a reduced cure cycle, high temperature polyimide system (Tg >/=250°C), with low dielectric constant and loss tangent (DK = 3.5, loss 0.009 at 1 MHz) for applications requiring opera...more.
PI，TP|35N|Arlon-MED
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35N is a pure polyimide laminate and prepreg system for applications requiring high temperature performance. High Tg (250°C) results in low Z-direction expansion for resistance to PTH failure during PWB processing, and minimizes risk of latent PTH defects in-service. Reduced temperature and time to ...more.
PI，TP|2011|Ensinger Inc.
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TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it's longterm th...more.
PI，TP|38N|Arlon-MED
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38N is an improved polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
PI，TP|2021|Ensinger Inc.
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TECASINT™ 2000 series of polyimide stock shapes provide a superior combination of high temperature and bearing and wear, properties that make it an ideal choice for the most demanding applications. TECASINT™ 2011 is very pure, and exhibits low outgassing. It is also characterized by it's longterm th...more.
PI，TP|37N|Arlon-MED
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37N is a polyimide low-flow prepreg suitable for bonding multilayer polyimide rigid-flex, attaching heat sinks to polyimide MLBs, or other applications where minimal and uniform resin flow is required.
PI，TP|MS|Comco Nylon GmbH
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PLAVIS is a super engineering plastic. PLAVIS polyimide has a unique chemical structure with some of the highest properties availiable. Nitrogen bonded to 3 carbons is the critical part of the chain and imparts the plastic with remarkable features and benefits.DAELIM makes PLAVIS isostatic molded ro...more.
PI，TP|ESD|Comco Nylon GmbH
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PLAVIS is a super engineering plastic. PLAVIS polyimide has a unique chemical structure with some of the highest properties availiable. Nitrogen bonded to 3 carbons is the critical part of the chain and imparts the plastic with remarkable features and benefits.DAELIM makes PLAVIS isostatic molded ro...more.
PI，TP|Resin XH1015 - Americas|SABIC
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Thermoplastic Polyimide Extem* XH1015 Resin. Also UL rating 94V0 at 1.5 and 3.0.
PI，TS|P10|Epoxy Technology Inc.
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A single component, modified polyimide, high-temperature grade, silver-filled, electrically and thermally conductive adhesive designed for semiconductor die attach and hybrid microelectronic packaging.
