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搜索结果列表 共搜到关于 H-FM 的物性记录约 20＋条,本页只展示最多20条记录
TPS+PP|H-FM|Cardia Bioplastics™
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Cardia Biohybrid™ H-FM is based on a blend of thermoplastic starch (TPS) and polyolefin's. This grade of resin is compatibilised to offer a high level of mechanical strength, good elongation properties and toughness. The resin is based on corn starch which is a renewable material. Cardia Biohybrid™...more.
PPS|FM-XTK304|SBHPP
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SUMIKON® FM-XTK304 is a Heat dissipative thermoplastic molding compounds, Electrical insulative (3W/mk)Glass fiber and inorganic filler filled Poly phenylene sulfide molding compound.
PPS|FM-TK216C|SBHPP
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SUMIKON® FM-TK-216C is a Heat dissipative thermoplastic molding compounds, Non-electrical insulative, Non halogen (5W/mk) Glass fiber and Heat dissipative filler filled Poly phenylene sulfide molding compound.
PPS|FM-XTK310|SBHPP
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SUMIKON® FM-XTK-310 is a Heat dissipative thermoplastic molding compounds, Electrical insulative, (10W/mk) Glass fiber and inorganic filler filled Poly phenylene sulfide molding compound.
PPS|FM-TK213A|SBHPP
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SUMIKON® FM-XTK213A is a Heat dissipative thermoplastic molding compounds, Non-electrical insulative (3W/mk) glass fiber and Heat dissipative filler filled Poly phenylene sulfide molding compound.
PC|FM-TC122|SBHPP
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SUMIKON® FM-TC122 is a Heat dissipative thermoplastic molding compounds, Non-electrical insulative, (2W/mk) filler filled Polycarbonate molding compound.
PPS|FM-XTK305|SBHPP
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SUMIKON® FM-XTK305 is a Heat dissipative thermoplastic molding compounds, Electrical insulative, (5W/mk) Glass fiber and inorganic filler filled Poly phenylene sulfide molding compound.
PPS|FM-TK217A|SBHPP
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SUMIKON® FM-XTK217A is a Heat dissipative thermoplastic molding compounds, Non-electrical insulative (7W/mk) glass fiber and Heat dissipative filler filled Poly phenylene sulfide molding compound. This grade is official registered UL with V-0 (t=1.0).
PPS|FM-MK-152X|SBHPP
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SUMIKON® FM-MK-152X is Glass fiber and inorganic filler filled Polyphenylene sulfide molding compound with good mechanical property grade with low halogen content. This grade is official registered UL with V-0 (t=1.5).
EPM|FM 264|Melos GmbH
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Conductive bedding compound.For cables and wire with max. 90°C operating temperature at conductor.
EPM|FM 1755|Melos GmbH
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Migration stabilised bedding compound for PVC insulation and PVC sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
PPS|FM-MK-120E|SBHPP
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SUMIKON® FM-MK-120E is Glass fiber and inorganic filler filled Polyphenylene sulfide molding compound with good mechanical property grade. This grade is official registered UL with V-0 (t=1.6).
EPM|FM 972|Melos GmbH
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Flame-retardant bedding compound for XLPE insulation and HFFR sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
EPM|FM 958|Melos GmbH
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Migration stabilised bedding compound for PVC insulation and PVC sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
NBR|FM 1724|Melos GmbH
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Non flame-retardant bedding compound for XLPE insulation and HFFR sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
EPM|FM 942|Melos GmbH
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Bedding compound for XLPE insulation and PVC sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
EPM|FM 908|Melos GmbH
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Migration stabilised bedding compound for PVC insulation and PVC sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
EPM|FM 1456|Melos GmbH
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Migration stabilised bedding compound for PVC insulation and PVC sheathing.Bedding compound for cables and wire with max. 90°C operating temperature at conductor.
PPS|FM-MK-150|SBHPP
备注说明：
SUMIKON® FM-MK-150 is Glass fiber and inorganic filler filled Polyphenylene sulfide resin molding compound with good mechanical property grade. This grade is official registered UL with V-0 (t=1.0).
